NFC Inlay Video
NFC Inlay Product Process 04 : Flip chip
A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(NFC) inlay.
If you have any enquiry about quotation or cooperation, please feel free to email us at firstname.lastname@example.org or use the following enquiry form.
Our sales representative will contact you within 24 hours. Thank you for your interest in our products.