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NFC Inlay Video

NFC Inlay Product Process 04 : Flip chip

Source:Card Cube Group Author:Card Cube Click: Update:2018/3/26 23:07:13 Tags:Inlay,Product,Process,Flip,chip,NFC

NFC Inlay Product Process 04 : Flip chip

A reliability of flip-chip bonded die as a function of anisotropic conductive paste (ACP) hybrid materials, bonding conditions, and antenna pattern materials was investigated during the assembly of radio frequency identification(NFC) inlay. 

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